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Taking On Demand CRM Integration to the Next Level
This white paper discusses current integration challenges facing businesses with mixed deployments and presents Oracle's vision and solution for comprehensive integration...
Sponsored by: Oracle
Date: September 2007 |
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Microsoft Startup Center - Where new businesses get started
Great business ideas don't turn into brand new businesses overnight. There are decisions to make, hoops to jump through, and a whole lot of information to dig up. Exactly...
Sponsored by: Microsoft
Date: January 2008 |
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Fax Purchasing Decision: Fax Server or Fax Service?
Looking for the fax delivery solution that's right for your business? This Davidson Consulting white paper compares and contrasts fax servers to fax services to h...
Sponsored by: Esker
Date: December 2007 |
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Faxing on Premise and on Demand: Servers, Services and Compliance
Fax communication presents a challenge for organizations seeking to improve business process efficiency. As fax has remained a medium of choice for business information t...
Sponsored by: Esker
Date: September 2007 |
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Hosted CRM Vendor Comparison Guide
Hosted CRM solutions make up a sizable portion of the growing CRM market. This guide breaks down the major players (Salesforce.com, RightNow Technologies, NetSuite, and O...
Sponsored by: Inside CRM
Date: January 2007 |
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- Showing items 1-40 of 48
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Utilizing Intel Virtualization Technology on an Intel 5000 Chipset Series-Based Platform
System architects in the Server and Workstation Multiprocessing environments have been actively using Virtualization Technology to realize cost savings through hardware c...
Company: Intel
Date: April 2007 |
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Video and Image Processing Design Using FPGAs
In this paper, the authors will look at the trends in video and image processing that are forcing developers to re-examine the architectures they have used in the past. T...
Company: Altera
Date: March 2007 |
Altera |
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Satisfying the Demand for Rapid Feature Enhancement in Consumer Display Products
Developers of consumer display products (i.e., High-Definition TeleVisions (HDTVs), monitors, and projectors) face a daunting design challenge. The Application-Specific S...
Company: Altera
Date: March 2007 |
Altera |
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Optimization of Silicon Technology for the IBM System z9
IBM 90-nm Silicon-On-Insulator (SOI) technology was used for the key chips in the System z9 processor chipset. Along with system design, optimization of some critical fea...
Company: IBM
Date: February 2007 |
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High-Speed Interconnect and Packaging Design of the IBM System z9 Processor Cage
This paper describes the system packaging and technologies of the IBM System z9 enterprise-class server. The central electronic complex of the system consists of four nod...
Company: IBM
Date: January 2007 |
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HP sx2000 Chipset
The HP sx2000 is an enterprise systems chipset that is designed to provide scalability, reliability, manageability and performance to meet the most demanding server needs...
Company: Hewlett-Packard (HP)
Date: December 2006 |
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Optimize High Performance for Storage Platforms
This presentation provides Storage Platform overview and design objectives. The presentation presents detailed platform examples and solutions and design example of where...
Company: Intel
Date: September 2006 |
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Intel Platform Capabilities on Windows Vista
This presentation describes new consumer & corporate usage models expected in Microsoft's next new major client operating system, Windows Vista. The presentation states t...
Company: Intel
Date: September 2006 |
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Intel Architecture and Silicon Cadence: The Catalyst for Industry Innovation
Intel has a long history of setting the pace of industry innovation with the relentless pursuit of Moore's Law. This pace of innovation has served the ever increasing nee...
Company: Intel
Date: September 2006 |
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zx2 Chipset
Hewlett-Packard's latest enterprise chipset for entry-level systems, the zx2, is designed to provide the reliability, performance, scalability, and manageability to meet ...
Company: Hewlett-Packard (HP)
Date: August 2006 |
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Device Driver and BIOS Development for AMD Multiprocessor and Multi-Core Systems
Device drivers and Basic Input/Output System (BIOS) code for Windows devices are as old as Windows - and each generation of hardware has presented both new opportunities ...
Company: Advanced Micro Devices (AMD)
Date: August 2006 |
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HP Integrity Servers: Delivering Reliability, Resiliency, and Repairability
In early 2006, Hewlett-Packard (HP) introduced a new chipset, known as sx2000, to its midrange and high-end cell-based Integrity severs. Many customers first focused on t...
Company: Ideas International
Date: August 2006 |
Ideas International |
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Intel 965 Express Chipset Family Memory Technology and Configuration Guide
This paper details the Intel 965 Express chipset family (G) MCH's technology enhancements, supported memory configurations, and memory organizations. It is intended for a...
Company: Intel
Date: July 2006 |
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Intel's Next Generation Integrated Graphics Architecture - Intel Graphics Media Accelerator X3000 and 3000
Gamers and Media enthusiasts have been long demanding better technology for unparallel ultra-realistic visual experience and the demand will be even greater in the future...
Company: Intel
Date: July 2006 |
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Dual-Core Processing Revs Up Toyota's Virtual Wind Tunnel
Toyota Motorsport's Formula One racecar designers rely on a virtual wind tunnel to analyze aerodynamics and predict how a given design will perform under real-life racing...
Company: Red Hat
Date: June 2006 |
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sx2000 Chipset
Hewlett-Packard's new enterprise systems chipset, the sx2000, is designed to provide the scalability, reliability, manageability and performance to meet customers' most d...
Company: Hewlett-Packard (HP)
Date: May 2006 |
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It Takes an Ecosystem to Make a Dual-Core Platform
This white paper provides an overview of the breadth and depth of the AMD64 ecosystem from both a hardware and software perspective, and highlight areas where IT practiti...
Company: Advanced Micro Devices (AMD)
Date: April 2006 |
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IBM System p5 Quad-Core Module Based on POWER5+ Technology: Technical Overview and Introduction
The Quad-Core Module (QCM) is based on the well-known POWER5 Dual-Core Module (DCM) technology. The dual core POWER5 chip and the dual core POWER5+ chip are packaged with...
Company: IBM
Date: March 2006 |
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Achieving High-Resolution Video Using Scalable Capture, Processing, and Display
New video applications are becoming possible with the advent of several enabling technologies: multicamera capture, increased PC bus bandwidth, multicore processors, and ...
Company: Hewlett-Packard (HP)
Date: February 2006 |
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Design, Modeling and Characterization of Embedded Capacitors for Decoupling Applications
Surface Mount Discrete (SMD) decoupling capacitors fail to provide decoupling above 100MHz. This paper presents the use of embedded thin film capacitors to provide decoup...
Company: IBM
Date: January 2006 |
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IBM eServer X3 Architecture: Application Server Performance Gains
The ability of application servers to deliver high performance varies greatly, depending on the specifics of any given customer's workload. IBM raises the bar for scalabl...
Company: IBM
Date: January 2006 |
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HP Superdome Hybrid Servers: Intel Itanium 2 and PA-RISC nPartition Mixing
HP Superdome servers based on the HP sx1000 chipset can support configurations with both PA-RISC nPartitions and Intel Itanium 2 nPartitions in the same server. This pape...
Company: Hewlett-Packard (HP)
Date: January 2006 |
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Heterogeneous Chip Multiprocessors
Heterogeneous (or asymmetric) chip multiprocessors present unique opportunities for improving system throughput, reducing processor power, and mitigating Amdahl's law. On...
Company: Institute of Electrical and Electronics Engineers
Date: November 2005 |
Institute of Electrical and Electronics Engineers |
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The V2.0+EDR Bluetooth SOC Architecture for Multimedia
This paper proposes the advanced Bluetooth SOC architecture for multimedia applications. The design includes baseband functions in compliance with Bluetooth Core Specific...
Company: Korea University
Date: November 2005 |
Korea University |
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The Evolution of Build-Up Package Technology and Its Design Challenges
This paper reviews Sequential Build-Up (SBU) laminate substrate development from its beginning in 1988. These laminated substrates are nonuniform structures composed of t...
Company: IBM
Date: September 2005 |
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Power Reflection Coefficient Analysis for Complex Impedances in RFID Tag Design
Kurokawa's method of calculating the power reflection coefficient from the Smith chart in the situation when one complex impedance is directly connected to another is app...
Company: Institute of Electrical and Electronics Engineers
Date: August 2005 |
Institute of Electrical and Electronics Engineers |
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Low-Cost Wafer Bumping
As the demand for flip-chip interconnects mounts across an increasingly large spectrum of products and technologies, several wafer-bumping processes have been developed t...
Company: IBM
Date: August 2005 |
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ASIC Implementation of a MIMO-OFDM Transceiver for 192 Mbps WLANs
Next generation Wireless Local Area Networks (WLANs) such as the IEEE 802.11n standard are expected to rely on multiple antennas at both transmitter and receiver to incre...
Company: ETH Zurich
Date: May 2005 |
ETH Zurich |
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From Moore's Law to Intel Innovation - Prediction to Reality
This paper reviews some of the important breakthroughs that Intel researchers have developed to remain on the trajectory predicted by Moore's Law. With some of the indust...
Company: Intel
Date: April 2005 |
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Configuring DDR2 Memory on Dell Platforms Based on the Intel E7520 and E7525 Chip Sets
In the summer of 2004, Dell introduced new dual-processor Power- Edge servers and Dell Precision workstations equipped with Intel Xeon processors with Extended Memory 64 ...
Company: Dell
Date: April 2005 |
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Intel Delivers First Dual-Core Chipsets in Q2 2005
On February 7, 2005, Intel announced that the initial production runs of its first dual-core processors were complete and that it planned to deliver two separate dual-cor...
Company: Intel
Date: April 2005 |
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The Role of Specialized Hardware in Network Security Gateways
This paper explores the potentials and pitfalls of using network security appliances running specialized Integrated Circuits (ICs). It offers a vision that includes a rol...
Company: Check Point Software Technologies
Date: January 2005 |
Check Point Software Technologies |
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The Advantages of 64-bit to SQL Server 2000
This Microsoft TechNet white paper explores how 64-bit technology can benefit enterprises using SQL Server to host large business intelligence (BI) solutions. The results...
Company: Hewlett-Packard (HP)
Date: January 2005 |
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EM64T: A Bridge to 64-Bit Computing
In this white paper, IDC examines the current environment surrounding the development of the Intel Xeon-based Extended Memory 64 Technology (EM64T) chip, code named "Noco...
Company: IDG (International Data Group)
Date: January 2005 |
IDG (International Data Group) |
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Decoding Convolutional and Turbo Codes in 3G Wireless
Decoding of forward error correcting (FEC) codes is the most computationally intensive part of symbol-rate processing in a basestation receiver and could consume up to 90...
Company: Texas Instruments
Date: January 2005 |
Texas Instruments |
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Intel 82801EB/ Intel 82801ER I/O Controller Hub 5 (Intel ICH5)/ I/O Controller Hub 5 R (Intel ICH5R)
This white paper discusses about the Intel 82801EB and Intel 82801ER (ICH5 and ICH5R, respectively) which are integral parts of the Intel chipsets in conjunction with the...
Company: Intel
Date: April 2003 |
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OFDM Receiver Design
Othogonal Frequency Division Multiplex (OFDM) has gained considerable attention in recent years. It has been adopted for various standards include the 802.11a wireless LA...
Company: Regents of the University of California
Date: December 2000 |
Regents of the University of California |
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ACT: A Cluster Co-Processor for 3G Baseband Wireless Architectures for wireless systems have traditionally been designed to meet real-time requirements, t on a limited die area, and operate within a low power budget. These ... Company: Institute of Electrical and Electronics Engineers | Institute of Electrical and Electronics Engineers |
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New Balance Uses HP Workstations to Design Footwear Footwear designers at New Balance required powerful, reliable computing hardware and software to help render three-dimensional CAD designs. The need for high-performance ... Company: Hewlett-Packard (HP) |
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The Programmable Logic Solution to Energy Consumption Challenges in Portable Electronics Emerging wireless and mass storage technologies such as Wi-Fi and Miniature Hard Disk Drives (HDD) are converging in portable electronics. Adopting these new features can... Company: QuickLogic | QuickLogic |
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